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november 2008 rev 3 1/16 16 vnd05bsp iso high side smart po wer solid state relay features output current (continuous): 9a @ t c =85c 5v logic level compatible input thermal shutdown under voltage shutdown open drain diagnostic output inductive load fast demagnetization very low standby power dissipation description the vnd05bsp is a monolithic device made using stmicroelectronics vipower technology, intended for driving resistive or inductive loads with one side grounded. this device has two channels, and a common diagnostic. built-in thermal shutdown protects the chip from over temperature and short circuit. the status output provides an indication of open load in on state, open load in off state, overtemperature conditions and stuck-on to v cc . type v dss r ds(on) i out v cc vnd05bsp 40 v 0.2 ? 1.6a 26 v 1 10 powerso-10 table 1. device summary package order codes tube tape & reel vnd05bsp vnd05bsp vnd05bsp13tr www.st.com
contents vnd05bsp 2/16 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1 functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.2 protecting the device against reverse battery . . . . . . . . . . . . . . . . . . . . . 12 4 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 ecopack? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 powerso-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
vnd05bsp list of tables 3/16 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 4. power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. switching (v cc =13v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 6. logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 7. protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 8. truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 9. powerso-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 10. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
list of figures vnd05bsp 4/16 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 3. current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 figure 4. i l(off) circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 5. t pol /t povl waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 6. switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 7. waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 8. typical application circuit with a schottky di ode for reverse supply protection . . . . . . . . . . 11 figure 9. typical application circuit with separate signal ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 10. powerso-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
vnd05bsp block diagram and pin description 5/16 1 block diagram and pin description figure 1. block diagram figure 2. configuration diagram (top view)
electrical specifications vnd05bsp 6/16 2 electrical specifications figure 3. current and voltage conventions 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not imp lied. exposure to absolute ma ximum rating conditions for extended periods may affect device reliability. refer also to the st microelectronics sure program and other relevant quality document. table 2. absolute maximum ratings symbol parameter value unit v (br)dss drain-source breakdown voltage 40 v i out output current (cont.) at tc=85c 9 a i out (rms) rms output current at tc=85c and f> 1hz 9 a i r reverse output current at tc=85c -9 a i in input current 10 ma -v cc reverse supply voltage -4 v i stat status current 10 ma v esd electrostatic discharge (1.5 k ? , 100 pf) 2000 v ptot power dissipation at t c = 25 c 59 w tj junction operating temperature -40 to 150 c tstg storage temperature -55 to 150 c
vnd05bsp electrical specifications 7/16 2.2 thermal data 2.3 electrical characteristics values specified in this section are for 8 electrical specifications vnd05bsp 8/16 table 6. logic inputs symbol parameter test cond itions min. typ. max. unit v il input low level voltage 1.5 v v ih (1) 1. the v ih is internally clamped at 6v about. it is possible to c onnect this pin to an higher voltage via an external resistor calculated to not exceed 10 ma at the input pin. input high level voltage 3.5 v v i(hyst.) input hysteresis voltage 0.2 0.9 1.5 v i in input current v in = 5 v; tj= 25c 30 100 a v icl input clamp voltage i in = 10 ma i in = -10 ma 56 -0.7 7v v table 7. protections and diagnostics symbol parameter test cond itions min. typ. max. unit v stat status voltage output low i stat = 1.6 ma 0.4 v v usd under voltage shutdown 3.5 4.5 6 v v scl status clamp voltage i stat = 10 ma i stat = -10 ma 56 -0.7 7v v t tsd thermal shutdown temperature 140 160 180 c t tsd(hyst) thermal shutdown hysteresis 50 c t r reset temperature 125 c v ol open voltage level off-state (1) 1. i ol(off) = (v cc -v ol )/r ol 2.5 4 5 v i ol open load current level on-state 5 180 ma t povl (2) 2. iso definition. status delay t pol (2) status delay
vnd05bsp electrical specifications 9/16 figure 4. i l(off) circuit figure 5. t pol /t povl waveforms figure 6. switching time waveforms
electrical specifications vnd05bsp 10/16 figure 7. waveforms table 8. truth table conditions input 1 input 2 output 1 output 2 diagnostic normal operation l h l h l h l h h h undervoltage x x l l h thermal shutdown channel 1 h x l x l channel 2 x h x l l openload channel 1 h l x l h l x l l l channel 2 x l h l x l h l l l output shorted to v cc channel 1 h l x l h h x l l l channel 2 x l h l x l h h l l
vnd05bsp application information 11/16 3 application information figure 8. typical application circuit with a scho ttky diode for reverse supply protection figure 9. typical application circuit with separate signal ground
application information vnd05bsp 12/16 3.1 functional description the device has a diagnostic output which indicates open load in on-state, open load in off- state, over temperature conditions and stuck-on to v cc . from the falling edge of the inpu t signal, the status output, in itially low to signal a fault condition (overtemperature or open load on-state), will go back to a high state with a different delay in case of overtemperature (tpovl) and in case of open open load (tpol) respectively. this feature allows to discriminate the nature of the detected fault. to protect the device against short circuit and over current condition, the thermal protection turns the integrated power mosfet off at a minimum junction temperature of 140c. when this temperature returns to 125c the switch is automatically turned on again. in short circuit the protection reacts with virtually no delay, the sensor being located inside the power mosfet area. an internal function of the devices ensures the fa st demagnetization of inductive loads with a typical voltage (v demag ) of -18v. this function allows to greatly reduces the power dissipation according to the formula: p dem = 0.5 ? l load ?( load ) 2 ? [(v cc +v demag )/v demag ] ? f where f = switching frequency and v demag = demagnetization voltage. the maximum inductance which causes the chip temperature to reach the shut-down temperature in a specified thermal environment is a function of the load current for a fixed v cc , v demag and f according to the above formula. in this device if the gnd pin is disconnected, with v cc not exceeding 16v, it will switch off. 3.2 protecting the device against reverse battery the simplest way to protect the device against a continuous reverse battery voltage (-26v) is to insert a schottky diode between pin 1 (gnd) and ground, as shown in the typical application circuit ( figure 8. ). the consequences of the voltage drop across this diode are as follows: if the input is pulled to power gnd, a negative voltage of -v f is seen by the device. (v il , v ih thresholds and v stat are increased by v f with respect to power gnd). the undervoltage shutdown level is increased by v f . if there is no need for the control unit to handle external analog signals referred to the power gnd, the best approach is to connect the reference potential of the control unit to node [1] (see figure 9. ), which becomes the common signal gnd for the whole control board. in this way no shift of v ih , v il and v stat takes place and no negative voltage appears on the input pin; this solution allows the use of a standard diode, with a breakdown voltage able to handle any iso normalized negative pulses that occours in the automotive environment.
vnd05bsp package and packing information 13/16 4 package and packing information 4.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in ecopack ? packages. ecopack ? packages are lead-free. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at www.st.com. 4.2 powerso-10 mechanical data figure 10. powerso-10 package dimensions detail "a" plane seating l a1 f a1 h a d d1 = = = = e4 0.10 a e c a b b detail "a" seating plane e2 10 1 eb he 0.25
package and packing information vnd05bsp 14/16 table 9. powerso-10 mechanical data dim. mm min. typ. max. a 3.35 3.65 a (1) 1. muar only poa p013p. 3.4 3.6 a1 0 0.10 b 0.40 0.60 b (1) 0.37 0.53 c 0.35 0.55 c (1) 0.23 0.32 d 9.40 9.60 d1 7.40 7.60 e 9.30 9.50 e2 7.20 7.60 e2 (1) 7.30 7.50 e4 5.90 6.10 e4 (1) 5.90 6.30 e1.27 f 1.25 1.35 f (1) 1.20 1.40 h 13.80 14.40 h (1) 13.85 14.35 h0.50 l 1.20 1.80 l (1) 0.80 1.10 0 8 (1) 2 8
vnd05bsp revision history 15/16 5 revision history table 10. document revision history date revision changes apr-2001 1 initial release. 03-may-2006 2 added contents, list of tables and figures. added table 10.: document revision history . 24-nov-2008 3 document reformatted and restructured. added table 1.: device summary . added ecopack? packages information.
vnd05bsp 16/16 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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